Power Solution

For low profile and compact components in power application, Inpaq provides total power inductor solutions for portable devices, smart phone, table PC/PAD, two process technolgies of Wire-wound platic molding with magnetic powders (Metal modling series) and Mutlilayer ferrite/ceramic co-firing in high temperature process (Multilayer Ferrite series). WIP and MIP series are available and JEIA Size: 2520/2016 for WIP, 2520/2016 for MIP series.

– Power Inductor, 0.24 – 4.7µH

Please contact us for more information.